东芝光耦DIP4封装规则Specification of DIP4 package
|
Toshiba Code |
11-5B2 |
|
|---|---|---|
|
Mounting |
Through Hole |
|
| Pins |
4 |
|
|
Weight (typ.) |
0.26 g |
|
|
Packing Method |
Magazine |
|
|
Minimum Quantity |
100 pcs/Magazine |
|
|
Package Dimensions (mm) |
|
|
|
MagazineDimensions (mm) |
Thickness: 0.5 mm |
A: Magazine, B: Stopper |
